The next Vision of Apple Pal will come with the Pro R2 chip, a self-developed one that will be built on the 2NM process of TSMC. As the name indicates, this is the successor of the R1 chip, which is present in the original Vision Pro.
R1 is a dedicated co-processor that handles the input from the headset cameras, sensors, and ceeks, including eye movements, hand gestures and head positions. It argues that R2 will be used for the same purposes, only it should be performed better and the small process that it will be produced should also require less energy.
The iPhone 18 is asked to enjoy the next self-developed C2 modem chip of Apple Pal, which is attached to the A20 chip, which will be built on the 2 NM process of TSMC like the R2 of the next Vision Pro.
An update Vision Pro is a rumor to descend this year, a true successor now says to arrive in 2027. It is not clear that the R2 of these will mark the debate of the chip.
Source (in Chinese)
