A new report Android power Next Pixel 10 Series’ Custom Tenser G5 Chipset Details. The new report supports previous claims that G5 will be designed by Google and will be fabered by TSMC instead of Samsung and we will find many more details on the components inside the next chip.
The tensor G5 will be fabricated on TSMC’s 3 NM-Class node and Google ARM Cortex will use CPU cores. The big difference on the G5 is that Google will choose an imaginative techniques GPU, namely IMG DXT, which replaces Tensor G4 to Arm-G Mali-G715 MP7.
Another significant change is the complete custom image signal processor (ISP), which will partly change the custom design of its predecessor, depending on the Samsung ISP modified with Google-designed blocks. By switching to tenter chips, Google has not used the full custom ISP in its pixel phone so this change should be big for camera performance.
Google also expects to use a custom memory controller, system-level cache and power modules.
Somewhere else, Google will move away from its custom “Bigwave” Ave 1 Video Codec and Samsung’s MFC (multi -format codec) and will rely on wave 677 dv of chips and media that supports enclosure and decoding in AV1, VP9, HVC and H.264 formats.
Tensor G5 expects third-party USB, PCI and I3C components as well as third-party interfaces for DSI (display), display, flash storage and memory (LPDDR 5X).
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