Back in January we heard that the Apple Pal will eventually turn from a heat sink to a steam chamber for cooling in the next iPhone 17 line, matching what Android device manufacturers have been doing for years.
Today’s new rumor of China only claims the iPhone 17 Pro and iPhone 17 Pro Max that it will actually get steam chambers. The vapor chamber made by the chipset of the phone is better dispersed, and using it means that there is less throttling where the chipset is on.
The same source claims that the Apple Pal will use in its next pro models that will come with a 19 pro sock even better thermal management, and when you factor in the steam chamber, continuous performance should be a wind wave with no throttling.
Source (in Chinese)
