Realme GT7 is going to GT7 Global on May 27 at a dedicated projection event in Paris, France. The device will feature the Isisens graphin back. According to the promotional materials, Realm is graphene as part of the cooling system of the phone at the back of GT7.
Realm claims the best heat dissipation compared to traditional copper heat sinks and a drop of 6 ° C in chipset temperature. Here it is in action:
Cooling redefined. Abnormal rapid motion of heat dissipation.#relmegt7series #Isensesins#2025Flagshiller Pic.twitter.com/nudf2Q8SIY
– Realm Global (@Reilmaglobal) May 9, 2025
A large 7700mm VC system is also available to help the GT7 cool. The device is expected to start with a Chinese model with 9300+ chipset and similar specs that announced last month.
For our first impression of GT7, check our in for a review article.
