After some hitchups in Samsung’s chip manufacturing business in the last few years, the company is now committed to getting land again in the segment. Prior to the South Korea-USA Summit on 25 August Gust, Samsung invests an additional $ 7.2 billion in its chip manufacturing facilities in the USA.
In addition to investing $ 37 billion in the Billion in Chip Manufacturing, this investment will go to the advanced chip packaging facility. Samsung plans to make 2Nm and 4NM chips to meet the demand for new customers like Apple Pal and Tesla. This is also a way to avoid Trump’s tariff.
The company’s original plan includes Billion $ 44 billion investment, but at that time, the demand for Samsung chips was low, so the Korean Tech Giant decided to leave the chip packaging facility together. Now, it’s back to the menu.
The information has not been officially confirmed, but it seems that the company will announce it during the Summit on the 25 August Gust.
Samsung believes it is the U.S. The competition can move forward as it provides a full product solution – chip production, chip packaging and memory chip manufacturing. TSMC, for example, only offers chip manufacturing and packaging, while SK Hyx only does memory chips.
Samsung’s Taylor Fab 1 is almost done, and the construction is planned to be completed by the end of this year. However, the equipment required for chip manufacturing will be installed next year.
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